Tangem designs and develops secure microchips, smart cards, and other embedded solutions with native support for blockchain operations. The company sources integrated semiconductor platforms directly from global leaders such as Samsung and NXP; it also fabricates its own chip designs at UMC in Singapore and Taiwan. The final products offer unparalleled levels of security compliance, with silicon design and manufacturing evaluated by institutions like CEA-Leti and EMVCo, and the code and architecture under audit by Kudelski Security and Applus+. Tangem operates in B2B2C and Enterprise segments, shipping complete products such as smart banknotes, hardware wallets, cold storage, contactless HSM, cryptographic bearer notes. The company also provides expertise to large institutions in the fintech sector and works with multiple state-level and national-level central banks worldwide.